After being processed, assembled and shaped from short-fber boards, it is coated with a coating.
Application feld:
It plays a load-bearing role in heat treatment processes, such as the heat treatment of wafers.
|
Density g/cm3 |
Bending Strength MPa |
Tensile Strength Mpa |
Compressive Strength Mpa |
Interlayer Shear Strength Mpa |
Resistivity um·Ω |
Thermal Conductivity (Vertical Direction) W/m·K |
Ash Content ppm |
Graphitization Temperature ℃ |
Size mm |
| 1.4 | 125 | 160 | 130 | 20 | 24 | 7.5 | ≤200&20 | ≥2000 | l≤2600 |
The above data are representative values and are not guaranteed values.
